Hitron Assoc.

12154 Darnestown RoadSuite 202
Gaithersburg, MD 20878
8 Employees

SBIR Award Summary

Total Number of Awards 5
Total Value of Awards $3.01MM
First Award Date 07/18/94
Most Recent Award Date 03/11/10

Key Personnel

Last Name Name Awards Contact
Chan Harry Chan 3 Message
Chan Dr. H. E. Chan 1
Chan H. Chan 1

5 Awards Won

Phase 2 SBIR

Agency: Defense Advanced Research Projects Agency
Topic: SB072-031
Budget: 03/11/10 - 05/31/11
PI: H. Chan

This Phase II effort proposes to design and develop a physically small patch and loop antenna made with high temperature superconducting (HTS) and multiferroic composite (MFC) materials for high frequency (HF) and directional finding (DF) applications. These antennas will harness and demonstrate the use of cryogenically cooled superconductive Jo...

Phase 1 SBIR

Agency: Defense Advanced Research Projects Agency
Topic: SB072-031
Budget: 01/17/08 - 09/25/08

This proposal presents a feasibility study and design of a small high temperature superconducting (HTS) antenna employing SQUIDs (Superconducting Quantum Interference Devices) technology that serve to target origination of RF energy and therefore provide accurate direction finding in a dense interference environment. The technical objectives are...

Phase 2 SBIR

Agency: Defense Advanced Research Projects Agency
Topic: SB941-035
Budget: 12/04/02 - 05/31/07

This proposal is a program to develop designs and processes for microwave devices for integration into battlefield microsensor systems and their communication link structures. These devices will incorporate novel materials such as high temperature superconductors (HTS), electro-optics and cryo-cooling features. The devices such as high-Q tunable...

Phase 2 SBIR

Agency: Defense Advanced Research Projects Agency
Topic: ARPA93-035
Budget: 05/22/95 - 05/30/97

This proposal investigates the integration of high-temperature superconductors & electro-optic materials by epitaxial growth to develop agile monolithic microwave & millimeter wave receivers. Of primary interests are the device architectures & the performance improvements obtained when active & passive devices are integrated for operation at cry...

Phase 1 SBIR

Agency: Defense Advanced Research Projects Agency
Topic: SB941-035
Budget: 07/18/94 - 02/18/95

The present trend in the packaging of advanced integrated circuit chip is toward various types of multi-chip modules (MCM). Of these, MCM-D employing film deposition is the one most capable of supporting hich system performance. This proposal considers MCM-D as the basis for implementing a variety of thin-film layers which could integrate...