Soldering Technology International, Inc.

102 Tribble Drive
Madison, AL 35758
http://www.solderingtech.com
46 Employees

SBIR Award Summary

Total Number of Awards 5
Total Value of Awards $1.74MM
First Award Date 02/15/05
Most Recent Award Date 08/29/06

Key Personnel

Last Name Name Awards Contact
Cooper Mrs. Casey H. Cooper 3 Message
Gjesvold Mr. Jason Gjesvold 2 Message

5 Awards Won

Phase 2 SBIR

Agency: Missile Defense Agency
Topic: MDA04-111
Budget: 08/29/06 - 08/29/08

Miniaturizing electronic packaging is critical to the advancement of electronics design and capability. Smaller, denser packages are required to increase data processing capability of current systems. The objective of the research project is to continue development of increased signal processing capability for interceptor electronics while mai...

Phase 2 SBIR

Agency: Missile Defense Agency
Topic: MDA04-116
Budget: 08/29/06 - 08/29/08

Imbedded Component/Die Technology provides a complete solution for mission critical electronics coupling high-density electronics with passive thermal management. Imbedded Component/Die Technology allows the 3-D configuration of multiple systems thus achieving the cost/weight ratio advantage of using the smallest form and fit factor components a...

Phase 1 SBIR

Agency: Missile Defense Agency
Topic: MDA05-019
Budget: 05/01/06 - 11/30/06

The need for increased reliability coupled with reduced size and weight has demanded the evolution of manufacturing process technologies for printed circuit board assembly. Imbedded Component/Die Technology (IC/DT) will advance electronics packaging to the next level by transforming two-dimensional component placement into a three-dimensional (...

Phase 1 SBIR

Agency: Missile Defense Agency
Topic: MDA04-111
Budget: 03/28/05 - 09/28/05

Imbedded Component / Die Technology (IC/DT) A 3-D Modular Designed CCA: The need for high reliability electronic military systems coupled with reduced size and weight factors has demanded the evolution of circuit card manufacturing technology for miniturizing and assembling printed circuit card assemblies into standard modular designed configura...

Phase 1 SBIR

Agency: Missile Defense Agency
Topic: MDA04-116
Budget: 02/15/05 - 08/14/05

Imbedded Component / Die Technology (IC/DT) A 3-D Modular Designed CCA for AVIONIC APPLICATIONS: The need for high reliability electronic military avionic systems coupled with reduced size and weight factors has demanded the evolution of circuit card manufacturing technology for miniaturizing and assembling printed circuit card assemblies into s...