Nanotechnology and Molecular Interconnects

Period of Performance: 04/01/2010 - 12/31/2010

$100K

Phase 1 STTR

Recipient Firm

NexGenSemi Corporation
27130A Paseo Espada, Suite 1405
San Juan Capistrano, CA 92675
Principal Investigator
Firm POC

Research Institution

Sandia National Laboratories
PO Box 5800
Albuquerque, NM 87185
Institution POC

Abstract

Graphene has become one of the most promising new materials to form semiconductor devices and microelectronic interconnects. NexGenSemi Corporation in collaboration with Sandia National Labs will develop a Patterned Graphene Interconnect (PGI) and material modification for nanofabrication of transistor devices. This process resolution will dip deep down into the state-of-the-art technology nodes, leveraging some of the mobility, bandgap, and nanoscale structure advantages of the material. During this program, SNL will focus on the supply and process mechanics of high quality graphene films and NGSC will focus on the physical process associated with PGI, both leading to hybrid and graphene based microelectronics. Special emphisys will be placed on developing a reliable/repeatable and low cost process model for future commercialization into VLSI applications. BENEFIT: The program would benefit the DOD and Commercial electronics by providing high frequency, highly integrated, low power electronics, leading to high speed digital signal processing in focal plane arrays and on board computing.