Multifunctional Diamond Sensor Development for Cognitive Missiles

Period of Performance: 02/01/2008 - 02/01/2010


Phase 2 SBIR

Recipient Firm

Aet, Inc.
1900 S. Harbor City Blvd. Suite 236
Melbourne, FL 32901
Principal Investigator


The thrust of this program is to perform research and development that will result in diamond sensors that can be integrated with a silicon-based integrated circuit for incorporation into the skin of cognitive missiles and other air vehicles. These sensors will be fabricated on a silicon chip to allow readout of data in real time. AET will design sensor readout circuitry and have it fabricated by a semiconductor fabrication company. AET s partner, Vanderbilt University will then fabricate diamond sensors on the silicon CMOS wafers. AET and Vanderbilt University have developed a detailed process strategy for integrating diamond sensors on a standard silicon IC chip. The primary technology task that remains to be accomplished is to develop the specific process variables that will allow the deposition of a diamond film that we believe give acceptable sensor characteristics and will not affect the operation of transistors and other components in the commercial silicon IC. At least two types of sensors, temperature and radiation, will be tested and characterized. Change of resistivity with temperature will be characterized as will the photoconductivity of the diamond sensors by using a laser technique for stimulating the devices in a similar way to the intended gamma radiation.