Integration of Bulk GaN with Diamond for Device-level Thermal Management Solutions

Period of Performance: 02/26/2008 - 08/25/2008


Phase 1 SBIR

Recipient Firm

Kyma Technologies, Inc.
8829 Midway West Road Array
Raleigh, NC 27617
Principal Investigator


In this Phase I proposal, Kyma Technologies will perform a proof of concept demonstration of high quality bulk GaN/diamond integration for advanced thermal management of high power density GaN-based device applications. The development effort will include separation of thin GaN layers from bulk substrates and bonding to diamond.