Innovative Manufacturing Technologies for Low Cost, High Reliability Electronic Packaging

Period of Performance: 03/04/2008 - 08/13/2008

$100K

Phase 1 SBIR

Recipient Firm

Temeku Technologies, Inc.
13873 Park Center RoadSuite 217
Herndon, VA 20171
Principal Investigator

Abstract

The Missile Defense Agency (MDA) is seeking new and innovative designs for improved large surfaced based Active Electronically Scanned Arrays (AESA) with high power efficiencies, increased functionality, and more efficient cooling systems. It is anticipated that AESA cooling systems must be capable of managing heat loads ranging from 3-8 kW/ft² (32-86 kW/m²). The Subambient Cooling System (SACS) developed by Raytheon Space and Airborne Systems, under MDA Advanced Systems (AS) funding, has demonstrated the ability to manage extremely high heat loads but is limited with the currently available commercial heat exchangers. Temeku Technologies, Inc., proposes to design and show feasibility of an alternative heat exchanger concept for SACS in Phase I, and deliver proof-of-concept via building and validating a prototype for demonstration in the ensuing Phase II. The proposed heat exchanger concept is expected to exceed conventional heat exchanger system performance and be suitable for use in the highest heat loading conditions for AESA.