CTE Matched Layered Diamond Heat Spreaders

Period of Performance: 02/13/2008 - 08/13/2009


Phase 1 SBIR

Recipient Firm

SP3 Corp.
2220 Martin Ave.
Santa Clara, CA 95050
Principal Investigator


The objective of this proposal is to demonstrate a diamond based thermal heatspreader with high thermal conductivity and CTE matching to any type of semiconductor device such as GaAs or other III-V compound laser diodes. This structure is constructed from layers of diamond and metals so the morphology is identical at any point on the surface and the edge quality is determined by a accuracy of a photolithographic patterning process rather than any inhomogenities of the material.