Nanocomposite for Electrically Conductive Structural Adhesives and Bolt Hole Fillers

Period of Performance: 04/10/2008 - 04/08/2011

$1.04MM

Phase 2 SBIR

Recipient Firm

Luna Innovations, Inc.
301 1st St Suite 200
Roanoke, VA 24011
Principal Investigator

Abstract

Existing electrically-conductive structural adhesives utilize large amounts of silver particles to achieve their desired electrical properties. There unfortunately exists a limit as to how much an adhesive s electrical properties can be enhanced using this approach due to mechanical property degradation past a certain loading of the electrically-enhancing phase. It is therefore difficult to achieve both significantly enhanced electrical and mechanical properties in one adhesive system that cures within the desired time frame. Using unique dispersion technology and conductive nanofillers during the Phase I program, Luna Innovations has demonstrated an eight order of magnitude increase in electrical conductivity over that of a base aerospace structural adhesive with an overall improvement in shear strength. The nanocomposite adhesive systems will be further optimized and developed during the Phase II program. Luna s approach in using commercial off the shelf epoxy adhesive / filler systems currently in use with the Air Force will prove advantageous by shortening development time and will result in an accelerated transition out to the field.