Development of High Temperature Low Cure Shrinkage Adhesives

Period of Performance: 09/01/1998 - 06/01/1999

$100K

Phase 1 STTR

Recipient Firm

Polycomp Technologies, Inc.
13963 Recuerdo Drive
Del Mar, CA 92014
Principal Investigator

Research Institution

Western Kentucky University
Department of Chemistry
Bowling Green, KY 42101
Institution POC

Research Topics

Abstract

The objective of this program is to develop high temperature adhesives with reduced cure shrinkage. The formation of polymers from smaller monomers is usually accompanied by a reduction in volume of the final polymer network. This shrinkage creates internal strain in the resin, creates internal defects, and adversely affects the mechanical and durability of the polymer and adhesive bond. We propose to formulate experimental adhesives with novel monomers, which expand upon cure, thereby reducing or eliminating polymerization shrinkage inherent in conventional polymer systems. A series of computational, chemo-physical and mechanical characterization tests will be used to confirm the feasibility of this concept.