Stress/Failure Analysis Software for Multi-Material Interfaces

Period of Performance: 09/07/1995 - 09/06/1996

$100K

Phase 1 STTR

Recipient Firm

Engineering Software Research & Developm
111 West Port Plaza, Suite 825 Array
St. Louis, MO 63146
Firm POC
Principal Investigator

Research Institution

Washington University
275 N Skinker Bldg, Suite 220
St. Louis, MO 63130
Institution POC

Abstract

The development of an innovative computer program with advanced capabilities for the evaluation of the mechanical strength of electronic components, subjected to thermal and mechanical loading, is proposed. The evaluation of strength is based on recent technological advances which make it possible to determine the natural straining modes and there intensities at singlular points associated with multi-material interfaces. The proposed Phase I project will be concerned with (a) proof of concept in a two-dimensional setting and (b) investigation of the feasibility of fully three-dimentional implementation of the computation of natural straining modes and their intensities, in conjunction with the hp-version of the finite element method. Proof of concept in the three-dimensional setting will be performed under Phase II. The proposed project will utilize an existing software infrastructure, called PEGASYS, which was developed by the small business concern (ESRD) over the past six years. PEGASYS has several innovative capabilities not available in other finite element programs. These include advanced postprocessing and a sound capability for a posteriori error assessment. The research institution (Washington University) will provide specialized expertise needed for effecting transfer of the new technology.