Multi-Spectral QWIP Focal Plane Arrays with On-Chip Analog-to-Digital Converter"

Period of Performance: 11/22/1994 - 12/31/1994


Phase 1 STTR

Recipient Firm

Advanced Device Technology, Inc.
99 Factory Street
Nashua, NH 03060
Principal Investigator
Firm POC

Research Institution

Massachusetts Institute of Technology
77 Massachusetts ave
Cambridge, MA 02139
Institution POC


Advanced Device Technology, Inc. (ADT) in collaboration with Massachusetts Institute of Technology (MIT) proposes to develop Multi-Spectral Quantum Well Deterctors (QWIP) Arrays with On-Chip Singnal Processor. The innovative features are: - ROICs are fabricated on low cost large area GaAs substrates. - 128x128 element array is fabricated on multi-layer dual band QWIP cture that is grown directly on GaAs substrates containing ROICs. - Detector array is integrated with the ROICs with monolighic metal Interconnectin instead of th estandard indium bumps. Detection of midwave band (3-5um) and long wave band (8-12um) signals takes place in the same pixel (co-located pixel) in a simultaneous fashi on. - An on-chip analog-to-digital converter (ADC) is incorporated with the ROICs. The dual use of the QWIP focal plane arrays (FPAs) i n the commercial and the military sectors are given. The material groth of multilayer QWIP structures by MBE technique is described. Detailed fabrication steps for the dual band FPA are shown. ROIC design and unit cell layout for GaAs circuits are shown. During Phase I, the material growth of QWIP structures and the array design will be initiated. During Phase II, 128x128 element FPA will be fabricated with on-chip signal processor. Its dual use in the commercial and the military sectors will be demonstrated.