Conductive Liquid Crystalline Elastomer Composite For Aircraft Gap Treatment

Period of Performance: 09/01/2003 - 09/01/2004


Phase 1 STTR

Recipient Firm

Cornerstone Research Group, Inc.
16 ?North Camino Miramonte
Tucson, AZ 85716
Principal Investigator
Firm POC

Research Institution

Kent State University
Office of the Comptroller
Kent, OH 44242
Institution POC


Cornerstone Research Group, Inc. and Liquid Crystal Institute of Kent State University jointly propose to develop and demonstrate material technologies enabling conductive liquid crystalline elastomer composite for aircraft gap treatment. This program will design and experimentally characterize multiple candidate formulations to develop conductive elastomer materials tailored for this application. It will establish correlation between material synthesis and processing conditions with performance and demonstrate feasibility of employing conductive liquid crystalline elastomer as aircraft gap treatment material. The proposed conductive elastomer composite provide the means to enhance performance and improve increase service life by increasing the elasticity and reducing tendency of compression set. It will also reduce operational cost by reducing weight of the conductive filler. The proposed program will also develop processing technologies to use conducting liquid crystalline elastomer composite for field repair of gap treatment material. This suite of new technologies will address the drawbacks of conventional metal filled elastomer gap treatment materials. Operational Benefits: 1. Enhance electrical conductivity of by tailoring conducting polymer network microstructure within elastomer through liquid crystal template synthesis. 2. Reduce weight of resulting conducting elastomer and reduce operating cost 3. Enhance durability and performance by improving elasticity and reducing compression set. 4. Easily processable into final product by molding. Commercial Applications: 1. EMI shielding for wiring and electronic instruments 2. Electrostatic Dissipation in packaging and flooring materials