Micromachined, Three-Dimensionally Integrated RF or RF-Optoelectronic Circuit Components

Period of Performance: 08/15/2002 - 02/14/2003

$99.9K

Phase 1 STTR

Recipient Firm

Linden Photonics, Inc.
1 Park Drive, Unit 10
Westford, MA 01886
Principal Investigator

Research Institution

University of Massachusetts Lowell
1 University Ave.
Lowell, MA 01854
Institution POC

Abstract

The use of 3D, micromachined high resistivity silicon to fabricate high frequency RF circuits which are self packaged and hermetic has been successfully demonstrated. To incorporate optical components in the hermetic silicon package an equivalent optical exit port from the hermetic package needs to be developed. We propose the demonstration of a compact, low cost, hermetic optical port using micromachined silicon for passive alignment of fibers and polymeric optical components to complement the RF hermetic ports that have been successfully demonstrated in the literature. If successful, this proposal will demonstrate the ability to make a compact, low cost, hermetic optical port using micromachined silicon to complement the RF hermetic ports using silicon that have been successfully demonstrated in the literature. Such an optical port is essential if 3D micromachined high density circuits are to reach their full potential for optoelectronic circuits. Will reduce cost of optical components manufacture by factor of 10. For DOD applications this means the ability to deploy sophisticated optical networks in the field and on the individual soldier level.