An Aluminum Nitride Package with Built-in Cooler for Cryogenic Temperatures

Period of Performance: 06/02/2000 - 12/02/2000

$70K

Phase 1 STTR

Recipient Firm

Sienna Technologies, Inc.
19501 144th Avenue NE Array
Woodinville, WA 98072
Firm POC
Principal Investigator

Research Institution

University of Arizona
888 N Euclid Ave
Tucson, AZ 85721
Institution POC

Abstract

A range of ultra-sensitive sensors and microelectronic devices operating at low power levels exhibit ultimate performance when background noise, caused by thermal fluctuations, is reduced by operating these devices at cryogenic temperatures. However, no suitable active localized cryogenic cooling technique as part of the device/IC package is available for these devices to be integrated into the systems. This program will develop an aluminum nitride package with an integrated, self-enclosed, energy efficient, active cryogenic cooling system for high performance, high sensitivity and high-density electronic devices. The proposed aluminum nitride package will incorporate a compact, built-in active cryogenic cooling system, free of hydrodynamic and electromagnetic noise. This provides high thermal control and dissipates multi-watt heat loads. In Phase I, large surface area micro-channels will be designed using a novel method and incorporated into aluminum nitride ceramic substrates. Three-dimensional thermal analysis will be conducted to estimate heat dissipation performance of the package. Aluminum nitride ceramic substrates incorporating the novel micro-channels design will be produced, insulated, hermetisized and metallized. Test vehicles will be fabricated to evaluate the 77oK base temperature stability of two ONR defined sensors attached/bonded to the aluminum nitride ceramic substrates with built-in cryogenic cooling system. The potential commercial applications for internally cryogenically cooled Aluminum Nitride ceramic packages include high performance RF devices, DDS, imaging systems, superconducting devices/systems, high-power/high-density processor chips, high- and ultra-sensitive sensing systems and aerospace and telecommunication electronics.