PIBO Dielectric Film for Advanced Microelectronics Packaging

Period of Performance: 08/09/2001 - 03/09/2002

$64.7K

Phase 1 STTR

Recipient Firm

Oxazogen, Inc.
1910 West St. Andrews Road
Midland, MI 48640
Principal Investigator
Firm POC

Research Institution

Michigan Molecular Institute
1910 West St. Andrews Road
Midland, MI 48640
Institution POC

Abstract

Electronics products in applications including mobile communications, work stations, small computers, automotive controls, and aerospace and military weapons systems are moving relentlessly toward smaller, thinner, and lighter formats in lower cost packages. Interconnect density requirements in these products are rapidly outstripping that which is achievable through fabrication of traditional multilayer printed wiring boards derived from currently available dielectric materials. Polyimidebenzoxazole (PIBO) film has low dielectric constant, low dissipation factor, low CTE, and excellent dimensional stability. These properties are a near-perfect match with requirements for dielectric substrates for next generation electronics packaging.PIBO dielectric film would offer significant advantage for use as a superior dielectric substrate for use in primary (chip scale, flip chip, ball grad array) or secondary (motherboard) packaging of integrated circuits. Potential end use applications include high frequency (microwave, mobile communications, digital) and high-end MLPWBS. Market potential for PIBO film in these applications exceeds $200 million per year.