Onboard Smart Sensors

Period of Performance: 04/26/1999 - 01/26/2000


Phase 1 SBIR

Recipient Firm

Nonvolatile Electronics, Inc.
11409 Valley View Road Array
Eden Prairie, MN 55344
Principal Investigator


Different smart sensor designs will be researched during this Phase I program in an effort to develop standardized modules that can be used across existing instrumentation systems. In particular, these designs will conform to the IEEE Standard 1451.2-1997 and yet be linkable into existing instrumentation systems including AATIS, CAIS, etc. Previous development work conducted for WPAFB in Dayton, Ohio on smart sensor network systems for aircraft transparency systems will be used as a basic for this research. A smart Transducer Interface Module (STIM) was developed during that program which used a nonvolatile random across memory (NVRAM) for the Transducer Electronic Data Sheet (TEDS). The various smart sensors developed during that program communicated over a four wire network bus with a Bus Master Module (BMM) which in turn communicated with a PC. Part of this study will be to develop a smart sensor module that is fully 1451.2-1997 compliant using the BMM design as a basis and to develop a Network Capable Application Processor (NCAP) to network multiple STIMs. Miniaturization will also be studied using NEVE's in-house hybrid wire bonding system as well as an "instrument on a chip" with NVE's integrated circuit design capability.