Thermal Management for Advanced 3D Packaging of Payload Electronics

Period of Performance: 04/26/1999 - 04/10/2000

$98.2K

Phase 1 SBIR

Recipient Firm

K Technology Corp.
2000 West Cabot Blvd.Suite 150
Langhorne, PA 19047
Principal Investigator

Research Topics

Abstract

k Technology Corporation (kTC) proposes to develop a unique 3D packaging configuration with high conductivity (> 900 W/mK), low coefficient of thermal expansion to match silicone or gallium arsenide, and low density (