Low Temperature Active Joining of Structural and Electronic Composites

Period of Performance: 04/20/1999 - 10/19/1999

$62.7K

Phase 1 SBIR

Recipient Firm

Materials Resources International
811 West 5th Street, Unit 2
Lansdale, PA 19446
Principal Investigator

Research Topics

Abstract

MRi is proposing a new low temperature active joining process, S-Bond, for joining metallic composite materials for use in missile fins, actuators and in electronic packaging and electronic thermal management. Key to the S-Bond process are a new family of active low temperature(200-450ºC) Sn(Zn)-Ag-Ti-X alloys that can wet and bond to aluminum, beryllium, and other metallic and refractory composites that contain graphite, carbon, alumina and silicon carbide fiber or particulate phases. S-Bond joining is conducted in air with these new alloys that directly react with surface compounds to form bonds without the need for fluxes or special surface treatments. This new metallic joining method introduces significant joining and performance advantages over fasteners and epoxies since S-Bond would eliminate the weight and stress concentration of fasteners and can be remelted to permit repair, where thermosetting epoxies could not. The Phase I investigation will evaluate and characterize several of the proposed low temperature active braze alloys joining several selected composites, including aluminum graphite and aluminum:SiC, a beryllium composite alloy, and carbon:carbon or C:SiC composites) that are being considered for missile and aerospace components. The objective of the proposed work is to demonstrate the feasibility of S-Bond joining for fabricating metallic composite missile and or space platform components by joining several simulations of fins/stabilizer structures, optical mirrors or antennas and/or electronic packages.