Thick Film Microdevice Manufacturing of Miniaturized Communication Components

Period of Performance: 12/18/1998 - 06/18/1999


Phase 1 SBIR

Recipient Firm

Nanomaterials Research, LLC
1831 Left Hand Circle
Longmont, CO 80501
Principal Investigator

Research Topics


The on-going revolution in device miniaturization in integrated circuits in particular, and microelectronics circuits in general, has benefited communications components and subsystems. However, many components in communication applications are based on non-silicon materials, are discrete and large relative to integrated circuits, require separate assembly during manufacturing, and are increasingly the components that determine the weight, size, and cost of the communication subsystems. Major cost, weight, and size reductions could be accomplished if recent advances in thick film materials and fabrication techniques could be developed and commercialized. Nanomaterials Research Corporation (NRC) seeks to demonstrate such a breakthrough by focussing on bulky inductive components commonly used in wideband power amplifiers. Phase I will demonstrate the proof-of-concept and establish the performance, Phase II will optimize, scale up and produce prototypes by the 100s, while Phase III will commercialize the technology. BENEFITS: Potential dual use applications include communication systems such as amplifiers and filters for cellular phones, satellite communications, or other wireless systems. The technology is also needed for wireless data transfer and for ensuring data integrity in Internet Commerce.