Wafer-Wafer Transfer for Packaging and Assembly of MEMS

Period of Performance: 12/10/1998 - 08/31/1999

$149K

Phase 1 SBIR

Recipient Firm

Advanced CMP Products, Inc.
825 Buckley Road
San Luis Obispo, CA 93401
Principal Investigator

Abstract

The objective of this proposal is to demonstrate the feasibility of vacuum micro-packaging for devices such as MEMS gyroscopes and accelerometers. Vacuum is critical for high Q-factor, surface-micromachined MEMS. Robust, low-cost solutions are needed for applications such as guided munitions and unattended sensors. Proposed work focuses on long-term reliability issues, such as outgassing, permeation, and metallization stability. In addition, scale-up from our current chip-scale process to wafer-scale will constitute a key proof-of-concept.