Patterning of Highly Conductive Microstructures in Ultraconductor (TM) Polymer Films

Period of Performance: 05/06/1998 - 11/05/1998

$65K

Phase 1 SBIR

Recipient Firm

Room Temperature Superconductors, Inc.
301 A North Main Street, P.O. Box 880
Sebastopol, CA 95473
Principal Investigator

Abstract

This SBIR Phase I project will demonstrate an advanced fabrication process for making patterned conducting paths, which are many orders of magnitude lower in resistance than metals, in films of a new class of conducting material, Ultraconductor polymers. The conductivity of these proprietary polymers exceeds 10 S/cm, at temperatures ranging from OK to 480K. Present Ultraconductor films carry in excess of 106 amps / cm2 without heating. Successful completion of the fabrication development will enable the application of Ultraconductor films to a range of high-value BMDO topic areas, such as fine pitch interconnects, and electromagnetic shielding. The proposed fabrication process has been experimentally demonstrated, and is an extension of successful fabrication processes. The technique utilizes applied fields for condensing and patterning the intrinsic conducting filaments in Ultraconducting films. The material, Ultraconductor polymer, is the product of 12 years published research, and 4 years proprietary development. Ultraconductors are presently being developed for a range of applications, in part under USAF and BMDO SBIR contracts. The follow-on Phase II project will optimize and develop the most successful technique, for scale-up to commercial production of the fabricated films, and their application to a range of product categories. Anticipated Benefits/Potential Commercial Applications of the Research or Development. The benefits of these exceptionally conductive, elastic, stable materials, in the proposed fabricated form, holds high commercial and strategic value for the country. The proposed fabrication process will enable UltraconductorE application to BMDO technical areas, including low resistance connectors, fine pitch interconnects, electromagnetic shielding, energy generation, storage, and electric propulsion.