Damage Detection and Identification of Adhesive Bonding in Metal Components

Period of Performance: 03/07/2007 - 03/06/2008


Phase 2 SBIR

Recipient Firm

Quest Integrated, Inc.
19823 58th Place S
Kent, WA 98032
Principal Investigator


A novel method for detecting adhesive failures in GRID-LOCK(R) structures is proposed using transient thermography. The method is suitable for rapid inspection of large areas. In addition to the development of a novel thermal application system, a head mounted display will be incorporated to enhance ease of use.