Trust Enabling Stacking Technology

Period of Performance: 12/19/2006 - 03/31/2009


Phase 2 SBIR

Recipient Firm

Irvine Sensors Corp.
3001 Red Hill Avenue, B3-108 Array
Costa Mesa, CA 92626
Principal Investigator


Irvine Sensors Corporation (ISC) proposes to develop a stacked-chip solution to allow the creation of fully trustable integrated circuits starting from non-trusted components. Our approach combines a trust-enabler stacked module, combining the non-trustable component with a reconfigurable interface layer functioning as a gate keeper. From a system viewpoint, the system designer can use the proposed module as a trustable single chip, both in physical sense (e.g. packaging size, footprint, IO interface) and in logical sense (level of IO signals, data rates). One (or few) standard trust-enabler stack (TES) can be used to provide security to many non-trusted components. All these can be accomplished while maintaining the size and appearance of the whole module as a single chip.