Revolutionary Epoxy Technology for High Tg MCM Substrates

Period of Performance: 04/01/1998 - 03/31/2000


Phase 2 SBIR

Recipient Firm

Aguila Technologies, Inc.
253 Pawnee Street
San Marcos, CA 92078
Principal Investigator


The goal of this program is the development of low cost, low-viscosity, high-performance epoxy resins cured by cynate esters for laminates for multichip modules (MCM) using the current infrastructure for printed wire board (PWB) fabrication. The revolutionary cyanate-cured epoxy (CCE), invented by the principle investigator, has been demonstrated to have very high temperature performance, low dielectric constants, and outstanding moisture resistance. In addition, the cost of CCEs is lower than that of cyanate ester and polyimide resins. In this proposal, new CCE laminate resins will be developed for use in MCMs. CCE resins for these applications should meet the conflicting requirements of low viscosity for solventless processing and high molecular weight to produce high cross-linking density with high Tg. Molecular design, synthesis, formulation, and analysis will be conducted to develop the most desirable CCE resin systems. Process development as well as qualification of the materials and laminates against established industry standards will be done. The CCE and its carbon-fiber-reinforced composites were selected as one of the best inventions by Longman Cartermill Innovation Magazine, Jun, 1994; reported by High Performance Plastics Magazine, 1993 and Reinforced Plastics Newsletter magazine, January, 1994, respectively.