Miniature High Heat Flux Heat Pipes for Cooling of Electronics

Period of Performance: 08/05/1999 - 08/04/2001


Phase 2 SBIR

Recipient Firm

Thermacore, Inc.
780 Eden Rd Ofc
Lancaster, PA 17601
Principal Investigator


Rapid advancement of modern electronics demand higher heat flux capability and lower ATs from: cooling devices. State-of-the-art heat pipes can provide passive and reliable cooling for heat fluxes up to 50W/cm2, which will become inadequate for future microprocessors, power electronics and laser diodes. In Phase I, a series of proof-of-concept miniature heat pipes incorporating three advanced high heat flux mechanisms were designed, fabricated and tested. The results successfully demonstrated the advanced mechanisms were capable of dissipating: over 200W/cm2 heat fluxes, a four-fold improvement over the state-of-the-art. In Phase II, the high beat flux heat pipe technology will be further improved to meet higher requirements. Prototype heat pipes will be designed and fabricated according to actual system requirements from four representative market sectors: Computers, Power Electronics, Laser Diodes, and Military Electronics. This will serve as a vehicle to bring the technology towards commercial markets. Phase 11 will also focus on designing generic marketing samples, determining manufacturing processes and establishing a pilot production line. Other Phase II efforts will include developing theoretical models and thermally conductive interfaces. Successful completion of Phase II will pave the way to high-volume production and commercialization of high beat flux heat pipes for commercial and military markets.