Nitride, Carbide and Non-Oxide In Situ Coatings Using RECVD,A New CVD Method

Period of Performance: 07/05/1998 - 07/05/2000


Phase 2 SBIR

Recipient Firm

MicroCoating Technologies (formerly CCVD)
5315 Peachtree Industrial Blvd.
Atlanta, GA 30341
Principal Investigator


Over 70% processing costs savings can now be realized using an environmentally friendly system for the metallization of non-conductive, low temperature substrates such as plastics. Current technology utilizes a vapor coating process that requires expensive large vacuum chambers which are limited to roll material to apply a conductive metal film to plastics. This conductive film allows for further metallization through electroplating. Standard CVD methods are not suitable to this task, as they require substrate temperatures that are damaging to plastics and other low temperature substrates. High adhesion, conductive coatings formed on roll sheet and shaped non-conductive substrates using a production line capable environmentally friendly technology will enable the electronics industry to produce lighter, smaller, and cheaper products with enhanced performance to benefit the military, industry and consumers. Phase I was concerned with the open atmosphere vapor deposition of metals, and non-oxide ceramics by an adaptation of the CCVD technique. Phase I demonstrated MCT's ability to metallize polyimide substrates with a variety of metals inculding nickel, which were then shown to electroplate well. We propose, in Phaes II, to develop these metal coatings to the optimized conductivities and surface morphologies for use in electroplating and further efficiently deposit the metal films onto polyimide and other desired substrates, while further improving the high quality already achieved. Additional studies will be performed as time and resources permit, on extending this novel technique to the deposition of conductive materials not covered in the Phase I effort. The Phase II end product will be a prototype coating system that could be purchased at a significantly lower cost than that of a traditional CVD or PVD system while allowing for a greater range of substrate materials and shapes.