Ultra Flexible Substrate

Period of Performance: 08/23/2004 - 11/30/2006

$750K

Phase 2 SBIR

Recipient Firm

Sarcos Research Corp.
360 Wakara Way
Salt lake City, UT 84108
Principal Investigator

Abstract

Sarcos has worked on the development of a new technology that enables electronic devices to be fabricated on filamentary and elongated prismatic flexible substrates which can then be interconnected to form large area and even volumetric flexible electronic and multi-regime systems. As part of the phase I effort we have analytically developed new approaches to interconnect flexible elongated body structure that contain microelectronic elements using processes suitable for mass production. A series of test devices were fabricated and simple experiments were performed to demonstrate the concept and to reduce the technical risks associated with the technology we plan to develop and implement as part of the Phase II effort. These simple arrangements allowed us: (1) to illustrate the benefits of our approach; and (2) to evaluate different interconnection approaches. The three test models were installed on complex surfaces having multiple radius of curvature. In Phase II we will fabricate thin film transistor, and thin film solar cell devices using plasma enhanced chemical vapor deposition and sputtering system on elongated substrate. These will be interconnected into large area ultraflexible substrates (e.g. rollable photovoltaic panel).