Integrated Solutions for Packaging of High Power Electronics

Period of Performance: 07/21/2000 - 10/31/2002

$750K

Phase 2 SBIR

Recipient Firm

K Technology Corp.
2000 West Cabot Blvd.Suite 150
Langhorne, PA 19047
Principal Investigator

Abstract

kTC demonstrated the feasibility of the AlSiC encapsulated thermal pyrolytic graphite (TPG) material system as a heat spreader. TPG is a highly aligned crystalline graphite with an in-plane thermal conductivity of 1700 W/mK (> 4X copper). The Phase I program established, through sample evaluation, key design, fabrication and performance characteristics. The thermal conductivity, density, and coefficient of thermal expansion (CTE) of the prototypes were determined. The conductivity of the demonstrated material was found to be 737 W/mK, which is nearly 2 times copper. The density was measured to be 2.6 g/cm3 (3.5 x less than cooper), and the CTE was 8.1 ppm/degrees C. In simulation, the performance of the encapsulated TPG heat spreaders was in good agreement with predicted values and as such provided lower temperature deltas than the base line materials. The claims of the SBIR Phase I program have been confirmed which has set the stage for a Phase II program. The AlSiC encapsulated TPG material fills a need not only for the target heat spreader application but also for many electronic packaging applications, which require high conductivity, low density and CTE.