Nonintrusive System for Extraction of Interlayer Printed Circuit Patterns

Period of Performance: 04/30/1998 - 04/20/2000


Phase 2 SBIR

Recipient Firm

425 Lakeside Drive
Sunnyvale, CA 94086
Principal Investigator

Research Topics


The goal of this Phase II program is to develop and demonstrate a prototype software system for nondestructive, realible, and cost-effective extraction of electrical trace topology from bare, multilayer printed circuit boards (PCBs). The input to the software will be x-ray radiographs of PCBs acquired by a commercial x-ray inspection system. The output of the software will be the trace topology in a standard industry format (Gerber). This Phase II effort builds upon a successful Phase I program where we demonstrated the feasibility of nondestructively reverse engineering interlayer circuit patterns in bare, multilayer PCBs using x-ray technology and sophisticated image processing techniques. In particular, in Phase I we: (1) identified a commercial x-ray imaging system and demonstrated its ability to image internal layers in bare, multilayer PCBs; (2) demonstrated extraction of electronic trace topology of outer layers; (3) formulated an approach for extracting trace topology of internal layers. The Phase II program will: (1) define the performance requirements of the prototype software system; (2) develop and implement algorithms to reliably extract the trace topologies of internal PCB layers, and export them in Gerber format; and (3) implement and demonstrate these algorithms in a prototype software system.