Novel Diamond/C/C Composites for Thermal Management

Period of Performance: 08/10/1993 - 08/20/1995

$497K

Phase 2 SBIR

Recipient Firm

Applied Sciences, Inc.
141 W. Xenia Ave. Array
Cedarville, OH 45314
Principal Investigator

Research Topics

Abstract

A need for a significant level of research and development in thermal management materials for advanced packaging technologies has been identified. In a Phase I SBIR program, we have investigated a novel composite material, i.e. diamond/carbon/carbon composite, which exhibits (1) thermal conductivity much greater than all the existing substrate materials, (2) tailable coefficient of thermal expansion (CTE) to match that of attaching components in electronic devices, (3) a high dielectric strength so that thin film metallization can be carried out on the surface, and (4) density much less than metals and ceramic materials. These results clearly establish the innovative DCC composite as a revolutionary dielectric substrate/heat sink materials. Remaining steps include the optimization of carbon/carbon composite processing and diamond deposition to obtain balanced physical, thermal, electrical, and mechanical properties, thin film metalliztion on DCC composites, fabrication of prototype IC package, and performance data bank establishment. In order to accomplish the steps needed to arrive at commercial viability of diamond/carbon/carbon composites, a Phase II research and development program is proposed. The proposed Phase II program would allow for a full development of a potentially revolutionary high performance dielectric substrate/heat sink material.