Advanced Composite Solder for Microelectronics

Period of Performance: 06/14/1993 - 06/14/1995


Phase 2 SBIR

Recipient Firm

International Electronic Materials
30275 Bainbridge Road
Cleveland, OH 44139
Principal Investigator

Research Topics


With the continued innovation and development of microelectornic circuitry toware higher density, faster speed, light in weight and smaller in size, the demands on solder interconnections, particularly for the board-level packaging, become increasingly stringent. The increased denisty and decreased size in solder joings, per se, draw concerns about the reliability of such solder joings which are made of conventional solder materials. Furthermore, it has also been a concern in the manufacturing sector that a significant portion of the cost in producing microelectronic assemblies is contributed by the inspection and rework of solder joints. The objectives of this project are to further advance the science and technology of solders by utilizing the fundamental scientific principles; to explore and establish teh technology for strengthening solder materials; o devise useful products which offer superior performance to conventional solders; and, concurrently, to explore thescientific and manufacturing feasiblity in reduction of lead (Pb) usuage in solder materials. The effort of the proposed phase II program will focus on three main areas; (i) to establish the material bse which imparts superior performance characteristics as demonstrated in the scouting effort of phase I program; (ii) to develop a process in producing the new mateirals in power form; (iii) to design the new materials in paste form to meet the commercial requirements of manufacturing automation using surface mount and fine pitch technology. It is anticipated that the success of the program will provide the government and industry a new generation of superior solder materials which are in ready-to-use and much-in-demand paste form as well as in other physical forms as desired for commercial applications.