3-D Digital Image Correlation Based Non-Destructive Testing System for Qualification of Additive Manufacturing Parts

Period of Performance: 07/31/2017 - 01/30/2018


Phase 1 SBIR

Recipient Firm

X-wave Innovations, Inc.
407 Upshire Circle Array
Gaithersburg, MD 20878
Firm POC, Principal Investigator


NIST's seeks a high resolution DIC technology for qualification of complex AM parts. To meet this critical need, X-wave Innovations Inc. proposes to develop a 3-Dimentional Digital Image Correlation (3-D DIC) based NDT system. The proposed effort builds upon the success of XII in developing a variety of NDT technologies (including DIC system) for advanced materials evaluation. The success of the proposed effort will result in not only a novel 3-D DIC NDT technology, but also a system that is accurate, fast, and easy to use. This system should be suitable for field applications to qualify AM parts and inspect defect type, size, and location in those parts.