High Temperature Adhesives for Reentry Vehicles

Period of Performance: 01/01/1987 - 12/31/1987

$450K

Phase 2 SBIR

Recipient Firm

PEM Research CO.
3104 ROBERTA DR
Largo, FL 33541
Principal Investigator

Abstract

THIS PROJECT INVOLVES THE EXAMINATION OF ADHESIVE SYSTEMS WHICH WE FEEL TO BE FEASIBLE FOR USE IN BONDING HEATSHIELDS TO REENTRY VEHICLES. THE TYPES OF ADHESIVES TO BE EXAMINED ARE THOSE WHICH WILL CURE AT LOW TEMPERATURE BUT WHICH WILL EXHIBIT HIGH TEMPERATURE PROPERTIES. SPECIFICALLY EPOXIES, SILICONE RUBBERS, DICYANATE ESTERS AND ACRYLIC ESTERS ARE AMONG SYSTEMS WHICH WILL BE STUDIED. ALSO TO BE EXAMINED ARE THREE NOVEL CURING METHODS. THESE ARE RF CURING, MICROWAVE DURING AND RADIATION CURING. TO ACCOMPLISH THIS TWO TEST FIXTURES WILL BE BUILT WHICH WILL SUBJECT THE ADHESIVE BOND TO STRESS AND THERMAL CONDITIONS SIMILAR TO THAT SEEN DURING REENTRY. ANALYSIS BOTH EXPERIMENTALLY AND ANALYTICALLY WILL BE PERFORMED. ULTIMATELY TESTING IN THE HIGH TEMPERATURE ARC-JET FACILITY AT AEDC WILL BE USED TO EVALUATE THE BOND. THOUGHT WILL BE GIVEN TO THE ADAPTION OF THE PROCESS TO PRODUCTION TO THE POINT WHERE TENTATIVE MATERIALS SPECIFICATIONS, QUALITY ASSURANCE SPECIFICATIONS AND MANUFACTURING SPECIFICATIONS WILL BE WRITTEN. A NUMBER OF CONSULTANTS WILL BE USED TO ASSIST IN THE PROGRAM. THIS INCLUDED PERSONS FROM GOVERNMENT LABORATORIES, INDUSTRY AND UNIVERSITIES.