Mechanistic Model Development for Gold Contaminated Solder Joint Reliability

Period of Performance: 04/25/2016 - 11/24/2016


Phase 1 STTR

Recipient Firm

DfR Solutions
9000 Virginia Manor Road Array
Beltsville, MD 20705
Firm POC
Principal Investigator

Research Institution

Rochester Institute of Technology
One Lomb Memorial Drive
Rochester, NY 14623
Institution POC


DfR Solutions and the Rochester Institute of Technology (RIT) have formed a team of experts in solder joint reliability and gold embrittlement to perform a series of experiments that will provide the data necessary to create mechanistic reliability models. Critical to any application of these models and of interpreting experimental results is the ability to determine solder joint gold contamination percent by weight. Phase I will explore non-destructive methods for plating measurement and gold content calculation, and perform destructive analysis to verify the optimal method for determining gold content in solder joints of physical samples. The gold content prediction methodology derived during Phase I will provide the basis for establishing an effective design of experiments to determine the long term reliability effects of various levels of gold contamination. In Phase II and beyond, DfR Solutions and RIT will perform the required testing and create mechanistic reliability models. Prior experience developing solder joint reliability models and a history of creating tools for industry to apply them reduces program risk and provides a clear path to commercial application. Approved for Public Release 16-MDA-8620 (1 April 16)