Printable Materials with Embedded Electronics and Radio Frequency Components (1000-349)

Period of Performance: 09/23/2016 - 02/22/2017


Phase 1 SBIR

Recipient Firm

SI2 Technologies
267 Boston Road Array
North Billerica, MA 01862
Firm POC
Principal Investigator


SI2 Technologies, Inc. (SI2) proposes to design, fabricate, and test printed structures with embedded RF components. These components include traces, waveguides, antennas, and connectors. SI2s materials are printed directly from a computer file in an ambient environment without any tooling, masks, etc. SI2s extensive materials printing and RF design experience will be brought to bear, affording lightweight, low-cost components. These components can be integrated unobtrusively with the airframes of legacy, current, and future Army weapons, such as forward-firing and air-dropped missile systems. The proposed program will build on SI2s successful development of 3D-printed phased arrays. In Phase II, SI2 will optimize the design of its Phase I components and ruggedize them to accommodate launch loads and exposure to temperature extremes. SI2 will then identify the most promising components for transition to the Army (e.g., the Modular Missile Technologies Program, MMT) based on simulated harsh environment testing.