Modular Thermal Management System for Electronics Enclosures

Period of Performance: 06/08/2016 - 12/05/2016

$80K

Phase 1 STTR

Recipient Firm

Mainstream Engineering Corporation
200 Yellow Place Array
Rockledge, FL 32955
Firm POC
Principal Investigator

Research Institution

Pennsylvania State University
110 Technology Center Building
University Park, PA 16802
Institution POC

Abstract

As Navy combat systems evolve, the heat loads produced by electronics enclosures continues to increase. Legacy thermal management techniques for these enclosures such as liquid cooling coupled to the ship chilled water supply and direct air cooling of the cabinets require infrastructure such as pipes and ducts which are expensive to install and reconfigure. Mainstream proposes to design a vapor compression thermal management system that can be installed in standard electronics enclosures and display consoles. The proposed strategy is highly modular and scalable for future increases in electronics heat generation. During Phase I, Mainstream will design a thermal management system and demonstrate the feasibility of the concept with the assistance of Pennsylvania State University. In the Phase I Option, we will transition the design to manufacture and qualify a pre-production prototype in Phase II.