Direct Surface Mount Ic Package for Pcb's

Period of Performance: 01/01/1987 - 12/31/1987

$500K

Phase 2 SBIR

Recipient Firm

International Micro Industries
8000 A COMMERCE PARKWAY
Mt. Laural, NJ 08054
Principal Investigator

Abstract

THIS EFFORT WILL FOCUS ON LOWERING COST AND IMPROVING PERFORMANCE BY ELIMINATING CERAMIC AND PLASTIC PACKAGES PRESENTLY USED IN SURFACE MOUNTING SEMICONDUCTOR CHIPS. THE CHIP WILL BE MOUNTED DIRECTLY TO A PREPARED FOOTPRINT ON THE PRINTED CIRCUIT BOARD (PCB) UTILIZING ADVANCED TAPE AUTOMATED BONDING (TAB) AND NEW CHIP OVERCOATING MATERIALS. A COMMERCIALLY AVAILABLE VLSI SHIP WITH MORE THAN 60 I/O'S WILL BE SELECTED (THE PRIME CANDIDATE IS A CHIP WITH 136 I/O'S) TO BE TAB SURFACE MOUNTED TO PCB'S AND THEN OVERCOATED WITH SPECIALIZED ENCAPSULANTS. PRIOR TO EXCISE AND SURFACE MOUNTING, THE CHIP WILL BE PROCESSED WITH ELECTROPLATED GOLD BUMPS ON EACH CHIP BONDING PAD, THEN INNER LEAD BONDED (ILB) TO A 35MM FILM OF POLYIMIDE MATERIAL TO WHICH COPPER FOIL HAS BEEN LAMINATED, AND THE APPROPRIATE CIRCUIT PATTERN ETCHED AND GOLD PLATED. THE ILB PROCESS IS ACCOMPLISHED WITH GANG BONDING, A SINGLE OPERATION THAT BONDS ALL OF THE CIRCUIT LEADS TO THEIR ASSIGNED BONDING PADS. THE SURFACE MOUNTED AND OVERCOATED CHIP-ON-BOARD WILL BE TESTED AND EVALUATED FOR ENVIRONMENTAL AND MECHANICAL PROTECTION PLUS THERMAL MANAGEMENT.