Development of Integrated Acousto-fluidic Components

Period of Performance: 01/01/1988 - 12/31/1988

$296K

Phase 2 SBIR

Recipient Firm

Defense Research Technologies, Inc.
3150 Adderley Court
Silver Spring, MD 20906
Principal Investigator

Abstract

THE PARAMETER THAT GOVERNS OPTIMAL ACOUSTO-FLUIDIC CIRCUIT OPERATION IS THE LENGTH OF THE INTERCONNECTING CHANNELS. THIS EFFORT WILL CENTER ON AN IMPLEMENTATION OF SSLPAS THAT MINIMIZES INTERCONNECTIONS TO VIRTUALLY "ZERO" LENGTH. VERTICAL LAMINATIONS WILL BE USED SO THAT THE OUTPUTS OF ONE SSLPA WILL DIRECTLY FEED INTO THE INTERACTION REGION OF THE NEXT. IN THE VERTICAL SCHEME, THE PLAN FORM OF INDIVIDUAL ELEMENTS WILL BE FORMED BY THE OPENINGS IN VERTICAL LAMINATES ARRANGED TO GENERATE A DESIRED SSLPA OUTLINE WITH STEPPED CONTOURS. PHASE I SHOWED THAT IN THE CONVENTIONAL HORIZONTAL LAYOUT OF LPAS, ONCE THE OUTPUTS WERE SHORTENED, LITTLE OR NO APPRECIABLE PERFORMANCE ADVANTAGE WAS OBTAINED BY USING THE SSLPA, OTHER THAN AN INCREASE IN INPUT IMPEDANCE. THIS INCREASED INPUT IMPEDANCE COULD NOT BE APPLIED TO DIFFERENTIAL AMPLIFIERS WITHOUT SIGNIFICANT LOSS IN DYNAMIC RANGE. HOWEVER, WHEN THE VERTICALLY STACKED INTEGRATED CIRCUIT (VESIC) FORMAT IS USED, SSLPAS CAN BE STAGED. THUS WITH THE HIGH INPUT IMPEDANCE MOST OF THE GAIN IS RECOVERABLE BETWEEN STAGES, AND, WHILE SSLPA MAY BE LITTLE OR NO STAGING LOSSES, RESULTING IN SELF-STAGED GAINS SIMILAR TO THOSE OF DIFFERENTIAL SYSTEMS. PACKAGING DENSITIES MAY BE INCREASED BY A FACTOR OF TEN BY ELIMINATING UNUSED SPACE.