Low Filler-concentration Advanced Thermal Management Materials for Power Systems Components

Period of Performance: 07/07/2014 - 10/07/2016


Phase 2 SBIR

Recipient Firm

ADA Technologies, Inc.
8100 Shaffer Parkway Array
Littleton, CO 80127
Principal Investigator


ABSTRACT: Abstract (No proprietary info): Thermal interface materials (TIMs) constitute an essential part of thermal management which is quickly becoming the limiting factor in high power, high functional density, and increasingly small-sized electronics for future U.S. Air Force (AF) platforms. Examples of critical applications of interest to the AF include that require improved thermal management include modern aircraft, directed energy systems, and satellites. TIMs aim to ensure a continuous thermal conductivity path between the heat source and heat sink/dissipater, thus permitting the efficient operation of electronics. The major impediment to achieving reliable TIMs is high thermal interfacial resistance, which increases over time due to introduction of air pockets and the loss of contact between the meshing surfaces under thermal cycling. To address this need, ADA Technologies, Inc. proposes a novel approach to synthesize high-performance TIM pads based on reduction of interfacial thermal resistance via electronic conduction. ADA s proposed TIM aims to realize significant improvements of the current state-of-the-art in thermal performance, reliability and install/rework. BENEFIT: Anticipated Benefits/Potential Commercial Applications of the Research and Development (No proprietary info): ADA has designed our efforts to realize high-performance TIM pads offering significant improvements over the current state-of-the-art. If successful, ADA s technology will permit the development and usage of electronics that offer higher power and faster operating speeds by providing more efficient heat management. This will directly benefit capabilities in next generation AF efforts such as those anticipated in military aircraft, directed energy systems, satellites, and avionics. Furthermore, this technology will have direct benefits in many commercial electronics including personal electronics (e.g., laptops, cell phones, music players) and civilian aircraft, spacecraft, and other microelectronics.