Nanostructured Thermal Interface Materials for Power System Components

Period of Performance: 06/24/2013 - 03/25/2014

$150K

Phase 1 SBIR

Recipient Firm

Oceanit Laboratories, Inc.
828 Fort Street Mall Suite 600
Honolulu, HI 96813
Principal Investigator

Abstract

ABSTRACT: Oceanit proposes a novel nanostructured film as thermal interface materials (TIMs) for efficient thermal managements of high power electronic components. The proposed TIMs is composed of highly conductive fibers to improve the bulk thermal conductivity and highly conductive bonding layer to reduce the total thermal contact resistance of TIMs. BENEFIT: Nanocomposite TIMs find applications in military environment that includes power system electronics and avionics systems comprising of high heat flux components. Several commercial sectors such as telecommunication, data farms and computing centers would greatly benefit from the high performance nanocomposite TIMs.