Multichannel Fiber Optic Package Interface for Avionics

Period of Performance: 07/17/2013 - 01/30/2015


Phase 2 SBIR

Recipient Firm

Ultra Communications, Inc.
990 Park Center Drive, Suite H Array
Vista, CA 92081
Principal Investigator


An opportunity exists to significantly reduce the cost of low-profile fiber optic transceivers utilized in harsh environment applications by exploiting advances made in optoelectronic (OE) packaging. Presently, the cost associated with traditional hermetic can (HC) packaging dominates the overall cost of transceivers fielded in the aerospace systems such as the F-35, F-22 and B-2. While electronic components are commonly used in mil-avionics without hermetic can packaging, OE components are relatively unproven. This program addresses fiber optic system affordability by 1) reducing the transceiver manufacturing costs by eliminating expensive ceramic substrates, metalized fiber and active alignment process, 2) reducing the transceiver assembly, handling and fiber-related repair costs by adding a removable fiber connector, and 3) reduce fiber cable maintenance costs by incorporating built-in-test for health monitoring of the fiber optic cable plant.