High Performance Thermal Packaging Substrate

Period of Performance: 01/01/2012 - 12/31/2012


Phase 1 SBIR

Recipient Firm

Applied Nanotech, Inc.
3006 Longhorn Blvd. Suite 107
Austin, TX 78758
Firm POC
Principal Investigator


Thermal Transfer is a critical part of power electronics application. Power electronics are being utilized with greater frequency in todays modern world. The power electronics market segments include high current carrying semiconductor devices such as IGBTs, MOSFETs, power transistors, and modules. These devices require high performance thermal management materials both in the packaging of the discrete devices as well as for the packaging of modules consisting of several or arrays of these devices. The market for power electronic thermal management products is projected to be $3.0B by 2015 with a compound annual growth rate (CAGR) of 1.6%.1The overall objective of this program (Phase I and Phase II) was to develop CarbAlTM-based advanced dielectric thermal management substrates for HEV power electronic and packaging applications, leading to better automotive performance and ecology economy. The proposed Phase I program is a continuation of the materials development completed internally at ANI. Choosing a polymer dielectric coating with the proper specifications provides ease of manufacture and eliminates two thermal interfaces compared to a bonded inorganic plate. We also have increased control over material thickness and superior thermal performance while continuing to meet our targets for dielectric voltage breakdown. The Phase I will focus on die attachment to the novel thermal management substrates. After initial substrate fabrication the samples will be screened for thermal management and electrical performance. After suitable materials and procedures are identified test boards for a Hybrid Electric Vehicle (HEV) power electronics module will be fabricated and sent to a major automotive manufacturer for testing. If successful, the technology developed through this project will provide and accurate, robust, reliable and cost- effective method for increasing the thermal capacity of power electronic devices. There is a critical and growing market need for this technology in hybrid electric vehicles as well as solid state lighting applications. The SBIR project team will share results of this program with commercial companies to accelerate commercialization of the technology in a marketable product form. While this program will not be the single solution, it will assist in the reduction of American and global energy consumption. Hybrid Electric Vehicles (HEVs) utilize a high efficiency internal combustion engines to drive electronic generators. HEV technology can be used for automobiles, trucks, rail and ship materials. The generators charge battery systems that provide propulsion through electric drive motors. The electronics that control power delivery between the battery and the drive motor generate a large amount of heat. This heat can cause problems with the reliability of the electronic components. The growth rate for hybrid vehicle technologies in the U.S. has grown 3700% in the past 10 years.2 This represents one of the single largest growing forms of alternative transportation. In fact, Global automakers have produced nearly 12 new models in the past two years alone (2008-2009). This represents tremendous opportunity for market penetration of new technology related to the hybrid gas/electric propulsion systems. This vehicle data is just part of the growing trend for the application of power electronics.