SBIR Phase I: Repair and Manufacturing of Integrated Circuit Probe Cards through Innovations in Electrochemical Printing

Period of Performance: 01/01/2008 - 12/31/2008


Phase 1 SBIR

Recipient Firm

Ionographics, Incorporated
3728 Wallingford Ave N
Seattle, WA 98103
Principal Investigator


This Small Business Innovation Research Phase I Project is to develop Electrochemical Printing technology for the repair of integrated circuit (IC) test probe cards. Electrochemical Printing (EcP) will be developed as a tool for repairing and manufacturing small quantities of high value metal micro-structures on probe cards. EcP is a maskless solid freeform fabrication technique that electrodeposits dense metal micro-scale patterns beneath a rastering microjet print nozzle. The broader impact of this research is to provide an economical means of repair for probe cards that are currently scrapped.