SBIR Phase II: Multimodal High-Conductivity Filler for Epoxy Molding Compounds

Period of Performance: 01/01/2004 - 12/31/2004

$499K

Phase 2 SBIR

Recipient Firm

SOMMER MATERIALS RESEARCH, INC.
587 North Main Street
North Salt Lake, UT 84054
Principal Investigator

Abstract

This Small Business Innovation Research Phase II project will focus on developing more efficient semiconductor packaging materials, which is one of the key challenges of the electronics industry where increasing power and reduced size of integrated circuits is creating heat dissipation challenges. Most epoxy molding compounds used to