SBIR Phase I: Photolithographic Patterning of Reactive Nano-scale Multilayer Materials for Hermetic Wafer Scale Packaging

Period of Performance: 01/01/2003 - 12/31/2003

$100K

Phase 1 SBIR

Recipient Firm

MicroHouse Technologies
5705 Lois Lane
Edina, MN 55439
Principal Investigator

Abstract

This Small Business Innovation Research Phase I project involves a feasibility study of lithographically patterning reactive nanoscale multilayer foils for use in hermetic waferscale packages for MEMS and other electronic devices. A patterned reactive foil sandwiched between two wafers can be ignited and will self-propagate, providing the heat needed for wafer bonding. Because the reaction is very rapid, heat is localized to the vicinity of the foil. Therefore high temperature hermetic bonds confined to the lithographic pattern are obtainable, while temperature sensitive components inside of the sealed package remain unaffected. These foils can also be used to join dissimilar materials with dramatically different thermal expansion coefficients without creating large residual stresses.