A Reliable Electronic Package for Space Exploration

Period of Performance: 01/01/2010 - 12/31/2010

$600K

Phase 2 SBIR

Recipient Firm

Sienna Technologies, Inc.
19501 144th Avenue NE Array
Woodinville, WA 98072
Firm POC
Principal Investigator

Abstract

The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230