Reliable Direct Bond Copper Ceramic Packages for High Temperature Power Electronics

Period of Performance: 01/01/2010 - 12/31/2010

$100K

Phase 1 SBIR

Recipient Firm

Sienna Technologies, Inc.
19501 144th Avenue NE Array
Woodinville, WA 98072
Firm POC
Principal Investigator

Abstract

The proposed program will develop highly reliable, hermetic, Si3N4 ceramic multichip modules to integrate commercially available SiC power devices to build power electronic modules for reliable operation above 500