A Reliable Electronic Package for Space Exploration

Period of Performance: 01/01/2008 - 12/31/2008

$100K

Phase 1 SBIR

Recipient Firm

Sienna Technologies, Inc.
19501 144th Avenue NE Array
Woodinville, WA 98072
Principal Investigator

Abstract

The proposed program will develop an hermetic, CTE matched, thermal shock resistant ceramic packaging technology that will facilitate the operation of Si and SiGe devices at extreme temperatures (-230ýýC to 130ýýC) encountered on the Moon and Mars. Processes to assemble the components into a hermetically sealed package will be identified and developed. Process and materials capability will be demonstrated by fabricating and testing a 12 or 28 pin single chip module test vehicle.